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Esec 8003 Wafer Dicing Saw
Esec 8003 Wafer Dicing Saw
 
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Product Code: 10033
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Description
 
The Esec 8003 is a semiautomatic wafer dicing saw for wafers up to 6". The Esec 8003 has a programmable spindle speed and variable feed rate to allow for maximum dicing control and repeatability.

Equipment Specifications:

Wafer diameter: 25.4mm-152.4mm (1in.-6in.)

Wafer thickness: 0.01mm-5.0mm (0.3mil-196.9mil)

X-axis (feed): 240mm (9.45in.)

Y-axis (index): 165mm (6.5in.)

Index step: 0.02mm-99.999mm (0.79mil-3937mil)

Z-axis (vertical): 10mm (.393in.)

Rotation angle: 0.01-165 degrees

Spindle speed: 15,000-50,000 rpm

Power requirements: 220VAC, 50/60Hz, 2.5kVa

Air pressure: 64-85 psi

Water pressure: to 85 psi

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